ECS 2014: The 2014 International Conference on
Electronics and Communication Systems

Prague, Czech Republic, April 2-4, 2014

About the Conference

* The 2014 International Conference on Electronics and Communication Systems is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics and Communication Systems and their advanced applications in real life.
* The Conference has a distinguished Organizing Committee, Steering and Program Committee with extensive academic qualifications, ensuring that the conference maintains high scientific standards and has a broad international coverage.  All the papers are subject to peer, thorough, strict review by committees' members or 2 or 3 additional reviewers. The names of the Organizing Committee, Steering and Program Committee members and reviewers appear always in the Proceedings (Hard-Copy Books + CD) and you can see them in http://www.europment.org/library .  All the Proceedings of 2013 are available in http://www.europment.org/library
* The proceedings of 2014 will be also available later in http://www.europment.org/library
Prague: This magical city of bridges, cathedrals, gold-tipped towers and church domes, has been mirrored in the surface of the swan-filled Vltava River for more than ten centuries. Almost undamaged by WWII, Prague's medieval centre remains a wonderful mixture of cobbled lanes, walled courtyards, cathedrals and countless church spires all in the shadow of her majestic 9th century castle that looks eastward as the sun sets behind her. Prague is also a modern and vibrant city full of energy, music, cultural art, fine dining and special events catering to the independent traveller's thirst for adventure. It is regarded by many as one of Europe's most charming and beautiful cities, Prague has become the most popular travel destination in Central Europe along with Bratislava and Krakow. Millions of tourists visit the city every year. Prague was founded in the later 9th century, and soon became the seat of Bohemian kings, some of whom ruled as emperors of the Holy Roman Empire. The city thrived under the rule of Charles IV, who ordered the building of the New Town in the 14th century - many of the city's most important attractions date back to that age. The city also went under Habsburg rule and became the capital of a province of the Austro-Hungarian Empire. In 1918, after World War I, the city became the capital of Czechoslovakia. After 1989 many foreigners, especially young people, moved to Prague. In 1992, its historic centre was inscribed on the UNESCO World Heritage List. In 1993, Czechoslovakia split into two countries and Prague became capital city of the new Czech Republic" (Source: http://wikitravel.org/en/Prague )
* Contact us by email: info@europment.org

The Proceedings of the Conference with all the accepted and registered papers of the conferences will be sent for indexing to:
ISI (Thomson Reuters), ELSEVIER, SCOPUS, Zentralblatt MATH, British Library, EBSCO, SWETS, EMBASE, CAS - American Chemical Society, EI Compendex, Engineering Village, DoPP, GEOBASE, Biobase, TIB|UB - German National Library of Science and Technology, American Mathematical Society (AMS), Inspec - The IET, Ulrich's International Periodicals Directory, Scholar Google. As in all the Previous Conferences, extended Versions of all the accepted Papers will appear in well-known and reputable international scientific journals (Indexed in SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc) and in SPRINGER VERLAG Books
      Check our Previous Books in Springer

Registration fees

Publication Ethics and Malpractice Statement

Deadlines          Short URL:  http://tinyurl.com/ecs2014

Keynote Lecture

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Paper Submission

Papers must be written in the correct format:  MS Word.doc  or LaTeX  or LaTeX2   and must be uploaded using the following form as .doc, or .pdf file.
All the Accepted and Registered Papers will be indexed as peer-reviewed publications.
Only full papers will be promoted to reviewers for peer thorough review. Abstracts will be rejected by default. For the review process only active scholars with many recent publications in ISI and/or SCOPUS will be used and the list with their names will be published in the Proceedings: Hard-Copy and CD-ROM as in all our previous conferences.  The deadline for paper submission expired. We do not accept papers any longer.

Organizing Committee

General Chairs

  1. Professor Bimal Kumar Bose
    Life Fellow IEEE,
    The University of Tennessee,
    Knoxville, USA
  2. Professor D. Subbaram Naidu,
    IEEE Fellow,
    Idaho State University, USA
  3. Professor  Imre Rudas,
    Obuda University, Budapest,
    Hungary
  4. Stamatios Kartalopoulos,
    IEEE Fellow,
    The University of Oklahoma, USA

Senior Program Chair

  1. Professor Abdullah Eroglu,
    Indiana University &
    Purdue University,
    Fort Wayne (IPFW), USA

Program Chairs

  1. Professor Pavel Loskot,
    Swansea University, UK
  2. Professor D. Subbaram Naidu,
    IEEE Fellow,
    Idaho State University, USA
  3. Professor Francesco Zirilli,
    Sapienza Università di Roma,
    Rome, Italy
     

Tutorials Chair

  1. Professor Kamisetty Rao
    IEEE Fellow
    Univ. of Texas at Arlington
    USA

Special Session Chair

  1. Prof. Panagiotis Agathoklis,
    University of Victoria,
    British Columbia, Canada

Workshops Chair

  1. Professor Ronald Tetzlaff,
    Technical University Dresden,
    Dresden, Germany

Local Organizing Chair

  1. Professor Klimis Ntalianis,
    Tech. Educ. Inst. of Athens (TEI),
    Athens, Greece

Publication Chair

  1. Professor Brett Nener,
    The University of Western Australia,
    Australia
  2. Professor Erol Gelenbe, IEEE Fellow,
    ACM Fellow, IET Fellow (former IEE),
    Imperial College,
    University of London, London, UK

Publicity Committee

  1. Professor Bharat Doshi,
    John Hopkins University,
    Mayrland, USA
  2. Professor Imre J. Rudas,
    Óbuda University, Budapest,
    Hungary

International Liaisons

  1. Professor Theodore B. Trafalis,
    University of Oklahoma, USA
  2. Professor Peter Szolgay,
    Pazmany Peter Catholic University,
    Hungary
  3. Professor Gang Yao,
    University of Illinois at
    Urbana - Champaign,
    USA
  4. Professor Tadeusz Kaczorek,
    IEEE Fellow,
    Warsaw University of Technology,
    Poland

Steering Committee

  • Prof. Erol Gelenbe, IEEE Fellow, ACM Fellow, IET Fellow (former IEE), Imperial College, University of London, London, UK
  • Prof. James Lam, IEEE Fellow, IET Fellow, IMA Fellow, The University of Hong Kong, Hong Kong
  • Tomas Zelinka, Czech Technical University in Prague, Czech Republic
  • Prof. M. Affan Badar, Indiana State University, Terre Haute, Indiana, USA
  • Prof. Chih-Cheng Hung, Southern Polytechnic State University, Marietta, GA, USA
  • Prof. Martin Bohner, Missouri University of Science and Technology, Rolla, Missouri, USA
  • Prof. Ravi P. Agarwal, Texas A&M University-Kingsville, Kingsville, Texas, USA

Program Committee

  • Prof. Lotfi Zadeh (IEEE Fellow,University of Berkeley, USA)
  • Prof. Leon Chua (IEEE Fellow,University of Berkeley, USA)
  • Prof. Michio Sugeno (RIKEN Brain Science Institute (RIKEN BSI), Japan)
  • Prof. Dimitri Bertsekas (IEEE Fellow, MIT, USA)
  • Prof. Demetri Terzopoulos (IEEE Fellow, ACM Fellow, UCLA, USA)
  • Prof. Georgios B. Giannakis (IEEE Fellow, University of Minnesota, USA)
  • Prof. George Vachtsevanos (Georgia Institute of Technology, USA)
  • Prof. Abraham Bers (IEEE Fellow, MIT, USA)
  • Prof. Brian Barsky (IEEE Fellow, University of Berkeley, USA)
  • Prof. Aggelos Katsaggelos (IEEE Fellow, Northwestern University, USA)
  • Prof. Josef Sifakis (Turing Award 2007, CNRS/Verimag, France)
  • Prof. Hisashi Kobayashi (Princeton University, USA)
  • Prof. Kinshuk (Fellow IEEE, Massey Univ. New Zeland),
  • Prof. Leonid Kazovsky (Stanford University, USA)
  • Prof. Narsingh Deo (IEEE Fellow, ACM Fellow, University of Central Florida, USA)
  • Prof. Kamisetty Rao (Fellow IEEE, Univ. of Texas at Arlington,USA)
  • Prof. Anastassios Venetsanopoulos (Fellow IEEE, University of Toronto, Canada)
  • Prof. Steven Collicott (Purdue University, West Lafayette, IN, USA)
  • Prof. Nikolaos Paragios (Ecole Centrale Paris, France)
  • Prof. Nikolaos G. Bourbakis (IEEE Fellow, Wright State University, USA)
  • Prof. Stamatios Kartalopoulos (IEEE Fellow, University of Oklahoma, USA)
  • Prof. Irwin Sandberg (IEEE Fellow, University of Texas at Austin, USA),
  • Prof. Michael Sebek (IEEE Fellow, Czech Technical University in Prague, Czech Republic)
  • Prof. Hashem Akbari (University of California, Berkeley, USA)
  • Prof. Yuriy S. Shmaliy, (IEEE Fellow, The University of Guanajuato, Mexico)
  • Prof. Lei Xu (IEEE Fellow, Chinese University of Hong Kong, Hong Kong)
  • Prof. Paul E. Dimotakis (California Institute of Technology Pasadena, USA)
  • Prof. Martin Pelikan (UMSL, USA)
  • Prof. Patrick Wang (MIT, USA)
  • Prof. Wasfy B Mikhael (IEEE Fellow, University of Central Florida Orlando,USA)
  • Prof. Sunil Das (IEEE Fellow, University of Ottawa, Canada)
  • Prof. Panos Pardalos (University of Florida, USA)
  • Prof. Nikolaos D. Katopodes (University of Michigan, USA)
  • Prof. Bimal K. Bose (Life Fellow of IEEE, University of Tennessee, Knoxville, USA)
  • Prof. Janusz Kacprzyk (IEEE Fellow, Polish Academy of Sciences, Poland)
  • Prof. Sidney Burrus (IEEE Fellow, Rice University, USA)
  • Prof. Biswa N. Datta (IEEE Fellow, Northern Illinois University, USA)
  • Prof. Mihai Putinar (University of California at Santa Barbara, USA)
  • Prof. Wlodzislaw Duch (Nicolaus Copernicus University, Poland)
  • Prof. Tadeusz Kaczorek (IEEE Fellow, Warsaw University of Tehcnology, Poland)
  • Prof. Michael N. Katehakis (Rutgers, The State University of New Jersey, USA)
  • Prof. Pan Agathoklis (Univ. of Victoria, Canada)
  • Dr. Subhas C. Misra (Harvard University, USA)
  • Prof. Martin van den Toorn (Delft University of Technology, The Netherlands)
  • Prof. Malcolm J. Crocker (Distinguished University Prof., Auburn University,USA)
  • Prof. Urszula Ledzewicz, Southern Illinois University , USA.
  • Prof. Dimitri Kazakos, Dean, (Texas Southern University, USA)
  • Prof. Ronald Yager (Iona College, USA)
  • Prof. Athanassios Manikas (Imperial College, London, UK)
  • Prof. Keith L. Clark (Imperial College, London, UK)
  • Prof. Argyris Varonides (Univ. of Scranton, USA)
  • Prof. S. Furfari (Direction Generale Energie et Transports, Brussels, EU)
  • Prof. Constantin Udriste, University Politehnica of Bucharest , ROMANIA
  • Dr. Michelle Luke (Univ. Berkeley, USA)
  • Prof. Patrice Brault (Univ. Paris-sud, France)
  • Prof. Jim Cunningham (Imperial College London, UK)
  • Prof. Philippe Ben-Abdallah (Ecole Polytechnique de l'Universite de Nantes, France)
  • Prof. Photios Anninos (Medical School of Thrace, Greece)
  • Prof. Ichiro Hagiwara, (Tokyo Institute of Technology, Japan)
  • Prof. Andris Buikis (Latvian Academy of Science. Latvia)
  • Prof. Akshai Aggarwal (University of Windsor, Canada)
  • Prof. George Vachtsevanos (Georgia Institute of Technology, USA)
  • Prof. Ulrich Albrecht (Auburn University, USA)
  • Prof. Imre J. Rudas (Obuda University, Hungary)
  • Prof. Alexey L Sadovski (IEEE Fellow, Texas A&M University, USA)
  • Prof. Amedeo Andreotti (University of Naples, Italy)
  • Prof. Ryszard S. Choras (University of Technology and Life Sciences Bydgoszcz, Poland)
  • Prof. Remi Leandre (Universite de Bourgogne, Dijon, France)
  • Prof. Moustapha Diaby (University of Connecticut, USA)
  • Prof. Brian McCartin (New York University, USA)
  • Prof. Elias C. Aifantis (Aristotle Univ. of Thessaloniki, Greece)
  • Prof. Anastasios Lyrintzis (Purdue University, USA)
  • Prof. Charles Long (Prof. Emeritus University of Wisconsin, USA)
  • Prof. Marvin Goldstein (NASA Glenn Research Center, USA)
  • Prof. Costin Cepisca (University POLITEHNICA of Bucharest, Romania)
  • Prof. Kleanthis Psarris (University of Texas at San Antonio, USA)
  • Prof. Ron Goldman (Rice University, USA)
  • Prof. Helmut Jaberg (University of Technology Graz, Austria)
  • Prof. Ardeshir Anjomani (The University of Texas at Arlington, USA)
  • Prof. Heinz Ulbrich (Technical University Munich, Germany)
  • Prof. Reinhard Leithner (Technical University Braunschweig, Germany)
  • Prof. Elbrous M. Jafarov (Istanbul Technical University, Turkey)
  • Prof. M. Ehsani (Texas A&M University, USA)
  • Prof. Sesh Commuri (University of Oklahoma, USA)
  • Prof. Nicolas Galanis (Universite de Sherbrooke, Canada)
  • Prof. S. H. Sohrab (Northwestern University, USA)
  • Prof. Rui J. P. de Figueiredo (University of California, USA)
  • Prof. Valeri Mladenov (Technical University of Sofia, Bulgaria)
  • Prof. Hiroshi Sakaki (Meisei University, Tokyo, Japan)
  • Prof. Zoran S. Bojkovic (Technical University of Belgrade, Serbia)
  • Prof. K. D. Klaes, (Head of the EPS Support Science Team in the MET Division at EUMETSAT, France)
  • Prof. Emira Maljevic (Technical University of Belgrade, Serbia)
  • Prof. Kazuhiko Tsuda (University of Tsukuba, Tokyo, Japan)
  • Prof. Milan Stork (University of West Bohemia , Czech Republic)
  • Prof. Lajos Barna (Budapest University of Technology and Economics, Hungary)
  • Prof. Nobuoki Mano (Meisei University, Tokyo, Japan)
  • Prof. Nobuo Nakajima (The University of Electro-Communications, Tokyo, Japan)
  • Prof. Victor-Emil Neagoe (Polytechnic University of Bucharest, Romania)
  • Prof. P. Vanderstraeten (Brussels Institute for Environmental Management, Belgium)
  • Prof. Annaliese Bischoff (University of Massachusetts, Amherst, USA)
  • Prof. Virgil Tiponut (Politehnica University of Timisoara, Romania)
  • Prof. Andrei Kolyshkin (Riga Technical University, Latvia)
  • Prof. Fumiaki Imado (Shinshu University, Japan)
  • Prof. Sotirios G. Ziavras (New Jersey Institute of Technology, USA)
  • Prof. Constantin Volosencu (Politehnica University of Timisoara, Romania)
  • Prof. Marc A. Rosen (University of Ontario Institute of Technology, Canada)
  • Prof. Thomas M. Gatton (National University, San Diego, USA)
  • Prof. Leonardo Pagnotta (University of Calabria, Italy)
  • Prof. Yan Wu (Georgia Southern University, USA)
  • Prof. Daniel N. Riahi (University of Texas-Pan American, USA)
  • Prof. Alexander Grebennikov (Autonomous University of Puebla, Mexico)
  • Prof. Bennie F. L. Ward (Baylor University, TX, USA)
  • Prof. Guennadi A. Kouzaev (Norwegian University of Science and Technology, Norway)
  • Prof. Eugene Kindler (University of Ostrava, Czech Republic)
  • Prof. Geoff Skinner (The University of Newcastle, Australia)
  • Prof. Hamido Fujita (Iwate Prefectural University(IPU), Japan)
  • Prof. Francesco Muzi (University of L'Aquila, Italy)
  • Prof. Claudio Rossi (University of Siena, Italy)
  • Prof. Sergey B. Leonov (Joint Institute for High Temperature Russian Academy of Science, Russia)
  • Prof. Arpad A. Fay (University of Miskolc, Hungary)
  • Prof. Lili He (San Jose State University, USA)
  • Prof. M. Nasseh Tabrizi (East Carolina University, USA)
  • Prof. Alaa Eldin Fahmy (University Of Calgary, Canada)
  • Prof. Gh. Pascovici (University of Koeln, Germany)
  • Prof. Pier Paolo Delsanto (Politecnico of Torino, Italy)
  • Prof. Radu Munteanu (Rector of the Technical University of Cluj-Napoca, Romania)
  • Prof. Ioan Dumitrache (Politehnica University of Bucharest, Romania)
  • Prof. Corneliu Lazar (Technical University Gh.Asachi Iasi, Romania)
  • Prof. Nicola Pitrone (Universita degli Studi Catania, Italia)
  • Prof. Miquel Salgot (University of Barcelona, Spain)
  • Prof. Amaury A. Caballero (Florida International University, USA)
  • Prof. Maria I. Garcia-Planas (Universitat Politecnica de Catalunya, Spain)
  • Prof. Petar Popivanov (Bulgarian Academy of Sciences, Bulgaria)
  • Prof. Alexander Gegov (University of Portsmouth, UK)
  • Prof. Lin Feng (Nanyang Technological University, Singapore)
  • Prof. Colin Fyfe (University of the West of Scotland, UK)
  • Prof. Zhaohui Luo (Univ of London, UK)
  • Prof. Wolfgang Wenzel (Institute for Nanotechnology, Germany)
  • Prof. Weilian Su (Naval Postgraduate School, USA)
  • Prof. Phillip G. Bradford (The University of Alabama, USA)
  • Prof. Ray Hefferlin (Southern Adventist University, TN, USA)
  • Prof. Gabriella Bognar (University of Miskolc, Hungary)
  • Prof. Hamid Abachi (Monash University, Australia)
  • Prof. Karlheinz Spindler (Fachhochschule Wiesbaden, Germany)
  • Prof. Josef Boercsoek (Universitat Kassel, Germany)
  • Prof. Eyad H. Abed (University of Maryland, Maryland, USA)
  • Prof. F. Castanie (TeSA, Toulouse, France)
  • Prof. Robert K. L. Gay (Nanyang Technological University, Singapore)
  • Prof. Andrzej Ordys (Kingston University, UK)
  • Prof. Harris Catrakis (Univ of California Irvine, USA)
  • Prof. T Bott (The University of Birmingham, UK)
  • Prof. T.-W. Lee (Arizona State University, AZ, USA)
  • Prof. Le Yi Wang (Wayne State University, Detroit, USA)
  • Prof. Oleksander Markovskyy (National Technical University of Ukraine, Ukraine)
  • Prof. Suresh P. Sethi (University of Texas at Dallas, USA)
  • Prof. Hartmut Hillmer(University of Kassel, Germany)
  • Prof. Bram Van Putten (Wageningen University, The Netherlands)
  • Prof. Alexander Iomin (Technion - Israel Institute of Technology, Israel)
  • Prof. Roberto San Jose (Technical University of Madrid, Spain)
  • Prof. Minvydas Ragulskis (Kaunas University of Technology, Lithuania)
  • Prof. Arun Kulkarni (The University of Texas at Tyler, USA)
  • Prof. Joydeep Mitra (New Mexico State University, USA)
  • Prof. Vincenzo Niola (University of Naples Federico II, Italy)
  • Prof. Ion Chryssoverghi (National Technical University of Athens, Greece)
  • Prof. Dr. Aydin Akan (Istanbul University, Turkey)
  • Prof. Sarka Necasova (Academy of Sciences, Prague, Czech Republic)
  • Prof. C. D. Memos (National Technical University of Athens, Greece)
  • Prof. S. Y. Chen, (Zhejiang University of Technology, China and University of Hamburg, Germany)
  • Prof. Duc Nguyen (Old Dominion University, Norfolk, USA)
  • Prof. Tuan Pham (James Cook University, Townsville, Australia)
  • Prof. Jiri Klima (Technical Faculty of CZU in Prague, Czech Republic)
  • Prof. Rossella Cancelliere (University of Torino, Italy)
  • Prof. Dr-Eng. Christian Bouquegneau (Faculty Polytechnique de Mons, Belgium)
  • Prof. Wladyslaw Mielczarski (Technical University of Lodz, Poland)
  • Prof. Ibrahim Hassan (Concordia University, Montreal, Quebec, Canada)
  • Prof. Stavros J.Baloyannis (Medical School, Aristotle University of Thessaloniki, Greece)
  • Prof. James F. Frenzel (University of Idaho, USA)
  • Prof. Vilem Srovnal,(Technical University of Ostrava, Czech Republic)
  • Prof. J. M. Giron-Sierra (Universidad Complutense de Madrid, Spain)
  • Prof. Walter Dosch (University of Luebeck, Germany)
  • Prof. Rudolf Freund (Vienna University of Technology, Austria)
  • Prof. Erich Schmidt (Vienna University of Technology, Austria)
  • Prof. Alessandro Genco (University of Palermo, Italy)
  • Prof. Martin Lopez Morales (Technical University of Monterey, Mexico)
  • Prof. Ralph W. Oberste-Vorth (Marshall University, USA)
  • Prof. Vladimir Damgov (Bulgarian Academy of Sciences, Bulgaria)
  • Prof. P.Borne (Ecole Central de Lille, France)

Topics of Interest

Microelectronics: Device characterization and modeling, Device physics and novel structures, Materials and characterization techniques, Reliability and failure analysis, Radiation effects, Packaging, surface mount technology, Optoelectronics, MEMS and MOEMS devices, Smart power devices and sensors, Custom and semi-custom circuits, Interconnects, Embedded system design, Systems on Chip (SoCs), Reconfigurable chip design, Design for testability, Low-voltage, low-power VLSI design, ANN applications, Circuits for wireless communications, Modelling and simulation (process, device, circuit, logic, timing, functional), Trends in sub-micron technologies, Special microelectronic devices (magnetic memory, novel memory, imaging), Signal processing and multiplexing, DRAM, SRAM, flash high density, NVM, Logic/microprocessors, embedded logic, SiGe, GaN, and SiC devices, SOI, RF mixed analog/digital, Quantum computing, Microactuators, sensors and sensor networks, Biomimetic devices, Terahertz technology, System level verification,

Nanoelectronics:
Nanomaterial, Nanofabriction, Nanomeasurement, Nanodevice, Nanocircuit, Nanocharacterization, Advanced silicon devices and device physics, Nanotechnology for IC manufacturing, RF and mixed signal ICs, Noise behavior of MOS structures, Non-volatile memory technologies, Computational nanoelectronics, Particle simulation methods, Parameter extraction techniques, Interconnect modeling and algorithms, Modeling fabrication processes and equipment, Ballistic and quantum mechanical effects, Characterization and processing of new materials, Reliability of nanodevices and ESD design, Novel devies and post-CMOS silicon device structure, Key process technologies to integrate sub-100 nm Si ULSIs, Advanced physics in nanoelectronics analysis and synthesis, Physics and chemistry of surface and interface phenomena, Sub-100 nm silicon CMOS devices and their integration technologies, Process control, failure analysis, yield enhancements and modeling, Analytical methods and simulation algorithms for nanoelectronics, Advanced silicon circuits and systems, Advanced digital, analog, mixed-signal, and memory, Low power technologies and power aware systems, Integration of circuit and device simulation, Analog and digital circuits composed of nanodevices, System-level integration and packaging technologies, Chemical phenomena in the design of nanocircuits, Neural network, fuzzy logic, and multi-valued logic, Physical and circuit models of nanodevices and interconnects, Benchmarking, calibration, and verification of simulators, Integrated nanolelectronics and multifunction integrated circuits, Design, modeling, and simulation of nanoelectronic integrated circuits, Design and CAD technologies for the advanced packaging and system integration, Modeling and simulation of thermal, mechanical and electrical performance of packaging and system integration

Quantum Electronics: Spintronics, Quantum computing, Single electron devices, Nanotubes and nanostructures, Quantum phenomena in nanoscale, Dynamics of nanostructures, Quantum transport and quantum devices, Quantum wire, quantum well, and quantum dot, Wireless cellular automata, Hybrid micro-nanoelectronic logic, Heterostructures and superlattices, Compound semiconductor materials and devices, Self-assembly, nano and molecular scale devices, Spin and carrier control in quantum nanostructures, Ab-initio calculations of the electronic properties of nanostructures

Biomolecular Electronics: Molecular switches, Molecular electronics, Molecular manufacturing, Molecular electronic devices, Nanocomputing-nanocomputers, Functioning molecular wires, Inorganic nanowires and nanocrystals, Molecular electronic memory technology, Molecular computing-molecular computers, Circuit paradigm in molecular electronics, Organic semiconductor devices and materials, Electrical properties of organic thin film and materials, DNA computing, Biophysics, Biocomputing and biocomputers, User interfaces and visualization, Bioelectronics and bioinformatics, Biomedical and microfluidic applications, Biotechnologies in the design of nanocircuits, Biomedical engineering and biomedical electronics, Carrier transport in molecular and biological systems, Algorithms and biochips for DNA, healthcare and proteins, Micro-nano electromechanical devices for bio- and chemical applications, High performance computing, numerical methods and algorithms, including optimization, Computational methods and integrated systems for biochemical and medical applications,

Optoelectronics: Optical Fibers, Optical Cables, Optical Fiber Devices, Fabrication, installations, Fiber Bragg gratings, Lightwave circuits, Optical Fiber amplifiers and lasers, Optical Polymer fibers, Photonic crystal fibers and related topics, Optical Active Devices and Modules, Semiconductor lasers, detectors and their arrays, Light emitting devices, Semiconductor laser amplifiers, Waveguide laser amplifiers, Optoelectronic/photonic integrated circuits, Optical logics, memories and other functional devices, Related materials, device fabrication and device physics, Packaging and modules and related topics, Optical Passive Devices and Modules, Optical waveguide integrated devices/circuits; Planar, Optical isolators and circulators, Optical modulators and switches, Optical fiber-waveguide coupling, packaging and modules, Planar glass and polymer materials and device fabrication, Photonic crystals, Optical MEMS, Micro-optics and related topics, Optical Transmission Systems and Technologies, High speed optical transmissions, Wavelength division multiplexing, Ultra-long haul transmissions, Trans-oceanic systems, FTTx systems, Optical interconnection, Optical signal processing, Optical analog systems and related topics, Optoelectronic Networks and Applications, Optical networking, architectures, design and planning,

Communications: Microwave Theory and techniques, Applications of Microwaves in Biomedicine, Computational Methods for Microwaves Engineering, CAD design for Microwave Systems, Microwaves Circuits, Finite Differences, Finite Volumes, Finite Elements for Microwaves, Boundary Elements Method (BEM) applied in Microwaves problems, Antennas and Radars, Finite Differences, Finite Volumes, Finite Elements for Antennas, Boundary Elements Method (BEM) applied in Antennas problems, Lightwave technology, Submillimeter-Wave techniques, Microwave High-Power techniques, Microwave and millimeter-Wave Integrated Circuits, Microwave and millimeter-Wave Integrated Solid State Devices, Microwave Acoustics, Filter and Passive Components, Microwave and Antennas Measurements, Microwave Superconductivity, RFIC's, Wave-guides, Microwave propagation, Ferrites devices. Cavities. Microwave Circuits, Periodic Structures and Filters, Tubes, Masers, Amplifiers, HF-VHF-UHF Engineering, Antennas, Reflectors and Lens Antennas, Arrays, Scattering, Propagation, Diffraction, Electromagnetic Compatibility Problems, Applied Electromagnetics, Electromagnetic Field, Numerical Methods for Electromagnetics, Mathematical Methods and Computational techniques for Microwaves, Mathematical Methods and Computational techniques for Antennas and Radars, Radio Engineering applications in Astronomy, Navigation, Aerospace Systems, Low noise techniques, Optical Fiber Systems, Communication Electronics, Signal Processing for Wireless Communication., Communications Switching and Routing, Physical Layer, ISDN, Computer Networks, Architectural Aspects, ATM Networks, Protocols, Network Architecture, Network Reliability, Narrow band and Broad band Networks, Modern Routing Problems, Privacy and Security Problems, Queuing Theory and Communications, Traffic Problems, Wireless and Mobile Computing, Communication Systems Integration, Cryptology, Military Communications, Internet, Programming Techniques in Communications Networks, Simulation Techniques in Telecommunications, Software for Communications Development and Simulation, Social Implications of Modern Communications, Soft Computing and Communications, Smart Interfaces, Computer/Communications Integration, Education.,  
 Others...

Location and Conference Venue

Conference Guide         About Prague         Map of Prague,      Photos From Prague,       Hotel (Conference Venue)

How to get to Prague,     Prague Travel Guide

 

Conference Publications

Accepted Papers are going to be published in

(a) Book, Hard-Copy Proceedings (will be sent to the following indexes: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
(b) CD-ROM Proceedings (will be sent to the following indexes: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
Review Procees for Book and CD-ROM:
Papers will undergo thorough peer review by 3 international experts. Reviewers have always proper academic qualifications (recent publications in SCOPUS and ISI). You will receive comments from those 3 reviewers and your paper might be
* a) accepted as it is (unaltered)
* b) accepted after minor revision
* c) accepted after major revision
* d) rejected
We cannot guarantee acceptance for cases b) and c), if the reviewers are not satisfied by your response and your (minor or major) modifications to your conference paper.


(c) After new peer thorough review of their extended versions in well-known and reputable international scientific journals (Indexed in SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
Review Process for Extended Version in collaborating journals:
Extended Versions of high-quality journals will undergo again thorough peer review by 3 international experts. You will receive comments from other reviewers and your extended paper might be
* a) accepted as it is (unaltered)
* b) accepted after minor revision
* c) accepted after major revision
* d) rejected
We cannot guarantee acceptance for cases b) and c), if the reviewers are not satisfied by your response and your (minor or major) modifications to your extended paper.

(d) E-Library