ESPCO 2013: The 2013 International Conference on Electronics, Signal Processing and Communication Systems

September 28-30, 2013, Venice, Italy

About the Conference

The 2013 International Conference on Electronics, Signal Processing and Communication Systems, ESPCO 2013, is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Signal Processing, Image Processing and Communication Systems and their modern applications.
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The Proceedings of the Conference with all the accepted and registered papers of the conferences will be sent for indexing to: ISI (Thomson Reuters), ELSEVIER, SCOPUS, Zentralblatt MATH, British Library, EBSCO, SWETS, EMBASE, CAS - American Chemical Society, EI Compendex, Engineering Village, DoPP, GEOBASE, Biobase, TIB|UB - German National Library of Science and Technology, American Mathematical Society (AMS), Inspec - The IET, Ulrich's International Periodicals Directory.

Registration fees         Keynote Lecture by Prof. Nicolas Zufferey     Keynote lecture  by Prof. Claudio Talarico     Keynote Lecture by Prof. Ivan Zelinka              

Publication Ethics and Malpractice Statement


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Paper Submission

We no longer accept papers for this conference.

Organizing Committee

General Chairs (Editors of the Proceedings)

  1. Professor Valeri Mladenov
    Technical University of Sofia
    1000 Sofia, Bulgaria
  2. Professor Klimis Ntalianis
    Tech. Educ. Inst. of Athens (TEI)
    Athens, Greece

Senior Program Chair

  1. Professor Philippe Dondon
    Rue A Schweitzer 33400 Talence

Program Chairs

  1. Professor Filippo Neri
    Dipartimento di Informatica e Sistemistica
    University of Naples "Federico II"
    Naples, Italy
  2. Prof. Constantin Udriste,
    University Politehnica of Bucharest,
  3. Professor Sandra Sendra
    Instituto de Inv. para la Gestión Integrada de Zonas Costeras (IGIC)
    Universidad Politécnica de Valencia

Tutorials Chair

  1. Professor Pradip Majumdar
    Department of Mechanical Engineering
    Northern Illinois University
    Dekalb, Illinois, USA

Special Session Chair

  1. Professor Pavel Varacha
    Tomas Bata University in Zlin
    Faculty of Applied Informatics
    Department of Informatics and Artificial Intelligence
    Zlin, Czech Republic

Workshops Chair

  1. Professor Ryszard S. Choras
    Institute of Telecommunications
    University of Technology & Life Sciences
    Bydgoszcz, Poland

Local Organizing Chair

  1. Professor Klimis Ntalianis,
    Tech. Educ. Inst. of Athens (TEI), Athens, Greece

Publication Chair

  1. Professor Gen Qi Xu
    Department of Mathematics
    Tianjin University
    Tianjin, China

Publicity Committee

  1. Professor Reinhard Neck
    Department of Economics
    Klagenfurt University
    Klagenfurt, Austria
  2. Professor Myriam Lazard
    Institut Superieur d' Ingenierie de la Conception
    Saint Die, France

International Liaisons

  1. Professor Ka-Lok Ng
    Department of Bioinformatics
    Asia University
    Taichung, Taiwan
  2. Professor Olga Martin
    Applied Sciences Faculty
    Politehnica University of Bucharest
  3. Professor Vincenzo Niola
    Departement of Mechanical Engineering for Energetics
    University of Naples "Federico II"
    Naples, Italy
  4. Professor Eduardo Mario Dias
    Electrical Energy and Automation
    Engineering Department
    Escola Politecnica da Universidade de Sao Paulo

Steering Committee

  • Professor Aida Bulucea, University of Craiova, Romania
  • Professor Zoran Bojkovic, Univ. of Belgrade, Serbia
  • Professor Metin Demiralp, Istanbul Technical University, Turkey
  • Professor Imre Rudas, Obuda University, Budapest, Hungary

Program Committee

  • Prof. Lotfi Zadeh (IEEE Fellow,University of Berkeley, USA)
  • Prof. Leon Chua (IEEE Fellow,University of Berkeley, USA)
  • Prof. Michio Sugeno (RIKEN Brain Science Institute (RIKEN BSI), Japan)
  • Prof. Dimitri Bertsekas (IEEE Fellow, MIT, USA)
  • Prof. Demetri Terzopoulos (IEEE Fellow, ACM Fellow, UCLA, USA)
  • Prof. Georgios B. Giannakis (IEEE Fellow, University of Minnesota, USA)
  • Prof. George Vachtsevanos (Georgia Institute of Technology, USA)
  • Prof. Abraham Bers (IEEE Fellow, MIT, USA)
  • Prof. David Staelin (IEEE Fellow, MIT, USA)
  • Prof. Brian Barsky (IEEE Fellow, University of Berkeley, USA)
  • Prof. Aggelos Katsaggelos (IEEE Fellow, Northwestern University, USA)
  • Prof. Josef Sifakis (Turing Award 2007, CNRS/Verimag, France)
  • Prof. Hisashi Kobayashi (Princeton University, USA)
  • Prof. Kinshuk (Fellow IEEE, Massey Univ. New Zeland),
  • Prof. Leonid Kazovsky (Stanford University, USA)
  • Prof. Narsingh Deo (IEEE Fellow, ACM Fellow, University of Central Florida, USA)
  • Prof. Kamisetty Rao (Fellow IEEE, Univ. of Texas at Arlington,USA)
  • Prof. Anastassios Venetsanopoulos (Fellow IEEE, University of Toronto, Canada)
  • Prof. Steven Collicott (Purdue University, West Lafayette, IN, USA)
  • Prof. Nikolaos Paragios (Ecole Centrale Paris, France)
  • Prof. Nikolaos G. Bourbakis (IEEE Fellow, Wright State University, USA)
  • Prof. Stamatios Kartalopoulos (IEEE Fellow, University of Oklahoma, USA)
  • Prof. Irwin Sandberg (IEEE Fellow, University of Texas at Austin, USA),
  • Prof. Michael Sebek (IEEE Fellow, Czech Technical University in Prague, Czech Republic)
  • Prof. Hashem Akbari (University of California, Berkeley, USA)
  • Prof. Yuriy S. Shmaliy, (IEEE Fellow, The University of Guanajuato, Mexico)
  • Prof. Lei Xu (IEEE Fellow, Chinese University of Hong Kong, Hong Kong)
  • Prof. Paul E. Dimotakis (California Institute of Technology Pasadena, USA)
  • Prof. M. Pelikan (UMSL, USA)
  • Prof. Patrick Wang (MIT, USA)
  • Prof. Wasfy B Mikhael (IEEE Fellow, University of Central Florida Orlando,USA)
  • Prof. Sunil Das (IEEE Fellow, University of Ottawa, Canada)
  • Prof. Panos Pardalos (University of Florida, USA)
  • Prof. Nikolaos D. Katopodes (University of Michigan, USA)
  • Prof. Bimal K. Bose (Life Fellow of IEEE, University of Tennessee, Knoxville, USA)
  • Prof. Janusz Kacprzyk (IEEE Fellow, Polish Academy of Sciences, Poland)
  • Prof. Sidney Burrus (IEEE Fellow, Rice University, USA)
  • Prof. Biswa N. Datta (IEEE Fellow, Northern Illinois University, USA)
  • Prof. Mihai Putinar (University of California at Santa Barbara, USA)
  • Prof. Wlodzislaw Duch (Nicolaus Copernicus University, Poland)
  • Prof. Tadeusz Kaczorek (IEEE Fellow, Warsaw University of Tehcnology, Poland)
  • Prof. Michael N. Katehakis (Rutgers, The State University of New Jersey, USA)
  • Prof. Pan Agathoklis (Univ. of Victoria, Canada)
  • Prof. P. Demokritou (Harvard University, USA)
  • Prof. P. Razelos (Columbia University, USA)
  • Dr. Subhas C. Misra (Harvard University, USA)
  • Prof. Martin van den Toorn (Delft University of Technology, The Netherlands)
  • Prof. Malcolm J. Crocker (Distinguished University Prof., Auburn University,USA)
  • Prof. S. Dafermos (Brown University, USA)
  • Prof. Urszula Ledzewicz, Southern Illinois University , USA.
  • Prof. Dimitri Kazakos, Dean, (Texas Southern University, USA)
  • Prof. Ronald Yager (Iona College, USA)
  • Prof. Athanassios Manikas (Imperial College, London, UK)
  • Prof. Keith L. Clark (Imperial College, London, UK)
  • Prof. Argyris Varonides (Univ. of Scranton, USA)
  • Prof. S. Furfari (Direction Generale Energie et Transports, Brussels, EU)
  • Prof. Constantin Udriste, University Politehnica of Bucharest , ROMANIA
  • Dr. Michelle Luke (Univ. Berkeley, USA)
  • Prof. Patrice Brault (Univ. Paris-sud, France)
  • Dr. Christos E. Vasios (MIT, USA)
  • Prof. Jim Cunningham (Imperial College London, UK)
  • Prof. Philippe Ben-Abdallah (Ecole Polytechnique de l'Universite de Nantes, France)
  • Prof. Photios Anninos (Medical School of Thrace, Greece)
  • Prof. Ichiro Hagiwara, (Tokyo Institute of Technology, Japan)
  • Prof. Metin Demiralp ( Istanbul Technical University / Turkish Academy of Sciences, Istanbul, Turkey)
  • Prof. Andris Buikis (Latvian Academy of Science. Latvia)
  • Prof. Akshai Aggarwal (University of Windsor, Canada)
  • Prof. George Vachtsevanos (Georgia Institute of Technology, USA)
  • Prof. Ulrich Albrecht (Auburn University, USA)
  • Prof. Imre J. Rudas (Obuda University, Hungary)
  • Prof. Alexey L Sadovski (IEEE Fellow, Texas A&M University, USA)
  • Prof. Amedeo Andreotti (University of Naples, Italy)
  • Prof. Ryszard S. Choras (University of Technology and Life Sciences Bydgoszcz, Poland)
  • Prof. Remi Leandre (Universite de Bourgogne, Dijon, France)
  • Prof. Moustapha Diaby (University of Connecticut, USA)
  • Prof. Brian McCartin (New York University, USA)
  • Prof. Elias C. Aifantis (Aristotle Univ. of Thessaloniki, Greece)
  • Prof. Anastasios Lyrintzis (Purdue University, USA)
  • Prof. Charles Long (Prof. Emeritus University of Wisconsin, USA)
  • Prof. Marvin Goldstein (NASA Glenn Research Center, USA)
  • Prof. Costin Cepisca (University POLITEHNICA of Bucharest, Romania)
  • Prof. Kleanthis Psarris (University of Texas at San Antonio, USA)
  • Prof. Ron Goldman (Rice University, USA)
  • Prof. Ioannis A. Kakadiaris (University of Houston, USA)
  • Prof. Richard Tapia (Rice University, USA)
  • Prof. F.-K. Benra (University of Duisburg-Essen, Germany)
  • Prof. Milivoje M. Kostic (Northern Illinois University, USA)
  • Prof. Helmut Jaberg (University of Technology Graz, Austria)
  • Prof. Ardeshir Anjomani (The University of Texas at Arlington, USA)
  • Prof. Heinz Ulbrich (Technical University Munich, Germany)
  • Prof. Reinhard Leithner (Technical University Braunschweig, Germany)
  • Prof. Elbrous M. Jafarov (Istanbul Technical University, Turkey)
  • Prof. M. Ehsani (Texas A&M University, USA)
  • Prof. Sesh Commuri (University of Oklahoma, USA)
  • Prof. Nicolas Galanis (Universite de Sherbrooke, Canada)
  • Prof. S. H. Sohrab (Northwestern University, USA)
  • Prof. Rui J. P. de Figueiredo (University of California, USA)
  • Prof. Valeri Mladenov (Technical University of Sofia, Bulgaria)
  • Prof. Hiroshi Sakaki (Meisei University, Tokyo, Japan)
  • Prof. Zoran S. Bojkovic (Technical University of Belgrade, Serbia)
  • Prof. K. D. Klaes, (Head of the EPS Support Science Team in the MET Division at EUMETSAT, France)
  • Prof. Emira Maljevic (Technical University of Belgrade, Serbia)
  • Prof. Kazuhiko Tsuda (University of Tsukuba, Tokyo, Japan)
  • Prof. Milan Stork (University of West Bohemia , Czech Republic)
  • Prof. C. G. Helmis (University of Athens, Greece)
  • Prof. Lajos Barna (Budapest University of Technology and Economics, Hungary)
  • Prof. Nobuoki Mano (Meisei University, Tokyo, Japan)
  • Prof. Nobuo Nakajima (The University of Electro-Communications, Tokyo, Japan)
  • Prof. Victor-Emil Neagoe (Polytechnic University of Bucharest, Romania)
  • Prof. E. Protonotarios (National Technical University of Athens, Greece)
  • Prof. P. Vanderstraeten (Brussels Institute for Environmental Management, Belgium)
  • Prof. Annaliese Bischoff (University of Massachusetts, Amherst, USA)
  • Prof. Virgil Tiponut (Politehnica University of Timisoara, Romania)
  • Prof. Andrei Kolyshkin (Riga Technical University, Latvia)
  • Prof. Fumiaki Imado (Shinshu University, Japan)
  • Prof. Sotirios G. Ziavras (New Jersey Institute of Technology, USA)
  • Prof. Constantin Volosencu (Politehnica University of Timisoara, Romania)
  • Prof. Marc A. Rosen (University of Ontario Institute of Technology, Canada)
  • Prof. Alexander Zemliak (Puebla Autonomous University, Mexico)
  • Prof. Thomas M. Gatton (National University, San Diego, USA)
  • Prof. Leonardo Pagnotta (University of Calabria, Italy)
  • Prof. Yan Wu (Georgia Southern University, USA)
  • Prof. Daniel N. Riahi (University of Texas-Pan American, USA)
  • Prof. Alexander Grebennikov (Autonomous University of Puebla, Mexico)
  • Prof. Bennie F. L. Ward (Baylor University, TX, USA)
  • Prof. Guennadi A. Kouzaev (Norwegian University of Science and Technology, Norway)
  • Prof. Eugene Kindler (University of Ostrava, Czech Republic)
  • Prof. Geoff Skinner (The University of Newcastle, Australia)
  • Prof. Hamido Fujita (Iwate Prefectural University(IPU), Japan)
  • Prof. Francesco Muzi (University of L'Aquila, Italy)
  • Prof. Les M. Sztandera (Philadelphia University, USA)
  • Prof. Claudio Rossi (University of Siena, Italy)
  • Prof. Christopher J. Koroneos (Aristotle University of Thessaloniki, Greece)
  • Prof. Sergey B. Leonov (Joint Institute for High Temperature Russian Academy of Science, Russia)
  • Prof. Arpad A. Fay (University of Miskolc, Hungary)
  • Prof. Lili He (San Jose State University, USA)
  • Prof. M. Nasseh Tabrizi (East Carolina University, USA)
  • Prof. Alaa Eldin Fahmy (University Of Calgary, Canada)
  • Prof. Ion Carstea (University of Craiova, Romania)
  • Prof. Paul Dan Cristea (University "Politehnica" of Bucharest, Romania)
  • Prof. Gh. Pascovici (University of Koeln, Germany)
  • Prof. Pier Paolo Delsanto (Politecnico of Torino, Italy)
  • Prof. Radu Munteanu (Rector of the Technical University of Cluj-Napoca, Romania)
  • Prof. Ioan Dumitrache (Politehnica University of Bucharest, Romania)
  • Prof. Corneliu Lazar (Technical University Gh.Asachi Iasi, Romania)
  • Prof. Nicola Pitrone (Universita degli Studi Catania, Italia)
  • Prof. Miquel Salgot (University of Barcelona, Spain)
  • Prof. Amaury A. Caballero (Florida International University, USA)
  • Prof. Maria I. Garcia-Planas (Universitat Politecnica de Catalunya, Spain)
  • Prof. Petar Popivanov (Bulgarian Academy of Sciences, Bulgaria)
  • Prof. Alexander Gegov (University of Portsmouth, UK)
  • Prof. Lin Feng (Nanyang Technological University, Singapore)
  • Prof. Colin Fyfe (University of the West of Scotland, UK)
  • Prof. Zhaohui Luo (Univ of London, UK)
  • Prof. Mikhail Itskov (RWTH Aachen University, Germany)
  • Prof. George G. Tsypkin (Russian Academy of Sciences, Russia)
  • Prof. Wolfgang Wenzel (Institute for Nanotechnology, Germany)
  • Prof. Weilian Su (Naval Postgraduate School, USA)
  • Prof. Phillip G. Bradford (The University of Alabama, USA)
  • Prof. Ray Hefferlin (Southern Adventist University, TN, USA)
  • Prof. Gabriella Bognar (University of Miskolc, Hungary)
  • Prof. Hamid Abachi (Monash University, Australia)
  • Prof. Karlheinz Spindler (Fachhochschule Wiesbaden, Germany)
  • Prof. Josef Boercsoek (Universitat Kassel, Germany)
  • Prof. Eyad H. Abed (University of Maryland, Maryland, USA)
  • Prof. F. Castanie (TeSA, Toulouse, France)
  • Prof. Robert K. L. Gay (Nanyang Technological University, Singapore)
  • Prof. Andrzej Ordys (Kingston University, UK)
  • Prof. Harris Catrakis (Univ of California Irvine, USA)
  • Prof. T Bott (The University of Birmingham, UK)
  • Prof. Petr Filip (Institute of Hydrodynamics, Prague, Czech Republic)
  • Prof. T.-W. Lee (Arizona State University, AZ, USA)
  • Prof. Le Yi Wang (Wayne State University, Detroit, USA)
  • Prof. George Stavrakakis (Technical University of Crete, Greece)
  • Prof. John K. Galiotos (Houston Community College, USA)
  • Prof. M. Petrakis (National Observatory of Athens, Greece)
  • Prof. Philippe Dondon (ENSEIRB, Talence, France)
  • Prof. Dalibor Biolek (Brno University of Technology, Czech Republic)
  • Prof. Oleksander Markovskyy (National Technical University of Ukraine, Ukraine)
  • Prof. Suresh P. Sethi (University of Texas at Dallas, USA)
  • Prof. Hartmut Hillmer(University of Kassel, Germany)
  • Prof. Bram Van Putten (Wageningen University, The Netherlands)
  • Prof. Alexander Iomin (Technion - Israel Institute of Technology, Israel)
  • Prof. Roberto San Jose (Technical University of Madrid, Spain)
  • Prof. Minvydas Ragulskis (Kaunas University of Technology, Lithuania)
  • Prof. Arun Kulkarni (The University of Texas at Tyler, USA)
  • Prof. Joydeep Mitra (New Mexico State University, USA)
  • Prof. Vincenzo Niola (University of Naples Federico II, Italy)
  • Prof. Ion Chryssoverghi (National Technical University of Athens, Greece)
  • Prof. Dr. Aydin Akan (Istanbul University, Turkey)
  • Prof. Sarka Necasova (Academy of Sciences, Prague, Czech Republic)
  • Prof. C. D. Memos (National Technical University of Athens, Greece)
  • Prof. S. Y. Chen, (Zhejiang University of Technology, China and University of Hamburg, Germany)
  • Prof. Duc Nguyen (Old Dominion University, Norfolk, USA)
  • Prof. Tuan Pham (James Cook University, Townsville, Australia)
  • Prof. Jiri Klima (Technical Faculty of CZU in Prague, Czech Republic)
  • Prof. Rossella Cancelliere (University of Torino, Italy)
  • Prof. L.Kohout (Florida State University, Tallahassee, Florida, USA)
  • Prof. D' Attelis (Univ. Buenos Ayres, Argentina)
  • Prof. Dr-Eng. Christian Bouquegneau (Faculty Polytechnique de Mons, Belgium)
  • Prof. Wladyslaw Mielczarski (Technical University of Lodz, Poland)
  • Prof. Ibrahim Hassan (Concordia University, Montreal, Quebec, Canada)
  • Prof. Stavros J.Baloyannis (Medical School, Aristotle University of Thessaloniki, Greece)
  • Prof. James F. Frenzel (University of Idaho, USA)
  • Prof. Mirko Novak (Czech Technical University in Prague,Czech Republic)
  • Prof. Zdenek Votruba (Czech Technical University in Prague,Czech Republic)
  • Prof. Vilem Srovnal,(Technical University of Ostrava, Czech Republic)
  • Prof. J. M. Giron-Sierra (Universidad Complutense de Madrid, Spain)
  • Prof. Zeljko Panian (University of Zagreb, Croatia)
  • Prof. Walter Dosch (University of Luebeck, Germany)
  • Prof. Rudolf Freund (Vienna University of Technology, Austria)
  • Prof. Erich Schmidt (Vienna University of Technology, Austria)
  • Prof. Alessandro Genco (University of Palermo, Italy)
  • Prof. Martin Lopez Morales (Technical University of Monterey, Mexico)
  • Prof. Ralph W. Oberste-Vorth (Marshall University, USA)
  • Prof. Vladimir Damgov (Bulgarian Academy of Sciences, Bulgaria)
  • Prof. Menelaos Karanasos (Brunel University, UK)
  • Prof. P.Borne (Ecole Central de Lille, France)

Topics of Interest


  • Device characterization and modeling
  • Device physics and novel structures
  • Materials and characterization techniques
  • Reliability and failure analysis
  • Radiation effects
  • Packaging, surface mount technology
  • Optoelectronics
  • MEMS and MOEMS devices
  • Smart power devices and sensors
  • Custom and semi-custom circuits
  • Interconnects
  • Embedded system design
  • Systems on Chip (SoCs)
  • Reconfigurable chip design
  • Design for testability
  • Low-voltage, low-power VLSI design
  • ANN applications
  • Circuits for wireless communications
  • Modelling and simulation (process, device, circuit, logic, timing, functional)
  • Trends in sub-micron technologies
  • Special microelectronic devices (magnetic memory, novel memory, imaging)
  • Signal processing and multiplexing
  • DRAM, SRAM, flash high density, NVM
  • Logic/microprocessors, embedded logic
  • SiGe, GaN, and SiC devices
  • SOI
  • RF mixed analog/digital
  • Quantum computing
  • Microactuators, sensors and sensor networks
  • Biomimetic devices
  • Terahertz technology
  • System level verification

  • Nanoelectronics:
  • Nanomaterial
  • Nanofabriction
  • Nanomeasurement
  • Nanodevice
  • Nanocircuit
  • Nanocharacterization
  • Advanced silicon devices and device physics
  • Nanotechnology for IC manufacturing
  • RF and mixed signal ICs
  • Noise behavior of MOS structures
  • Non-volatile memory technologies
  • Computational nanoelectronics
  • Particle simulation methods
  • Parameter extraction techniques
  • Interconnect modeling and algorithms
  • Modeling fabrication processes and equipment
  • Ballistic and quantum mechanical effects
  • Characterization and processing of new materials
  • Reliability of nanodevices and ESD design
  • Novel devies and post-CMOS silicon device structure
  • Key process technologies to integrate sub-100 nm Si ULSIs
  • Advanced physics in nanoelectronics analysis and synthesis
  • Physics and chemistry of surface and interface phenomena
  • Sub-100 nm silicon CMOS devices and their integration technologies
  • Process control, failure analysis, yield enhancements and modeling
  • Analytical methods and simulation algorithms for nanoelectronics
  • Advanced silicon circuits and systems
  • Advanced digital, analog, mixed-signal, and memory
  • Low power technologies and power aware systems
  • Integration of circuit and device simulation
  • Analog and digital circuits composed of nanodevices
  • System-level integration and packaging technologies
  • Chemical phenomena in the design of nanocircuits
  • Neural network, fuzzy logic, and multi-valued logic
  • Physical and circuit models of nanodevices and interconnects
  • Benchmarking, calibration, and verification of simulators
  • Integrated nanolelectronics and multifunction integrated circuits
  • Design, modeling, and simulation of nanoelectronic integrated circuits
  • Design and CAD technologies for the advanced packaging and system integration
  • Modeling and simulation of thermal, mechanical and electrical performance of packaging and system integration

  • Quantum Electronics:
  • Spintronics
  • Quantum computing
  • Single electron devices
  • Nanotubes and nanostructures
  • Quantum phenomena in nanoscale
  • Dynamics of nanostructures
  • Quantum transport and quantum devices
  • Quantum wire, quantum well, and quantum dot
  • Wireless cellular automata
  • Hybrid micro-nanoelectronic logic
  • Heterostructures and superlattices
  • Compound semiconductor materials and devices
  • Self-assembly, nano and molecular scale devices
  • Spin and carrier control in quantum nanostructures
  • Ab-initio calculations of the electronic properties of nanostructures

  • Biomolecular Electronics:
  • Molecular switches
  • Molecular electronics
  • Molecular manufacturing
  • Molecular electronic devices
  • Nanocomputing-nanocomputers
  • Functioning molecular wires
  • Inorganic nanowires and nanocrystals
  • Molecular electronic memory technology
  • Molecular computing-molecular computers
  • Circuit paradigm in molecular electronics
  • Organic semiconductor devices and materials
  • Electrical properties of organic thin film and materials
  • DNA computing
  • Biophysics
  • Biocomputing and biocomputers
  • User interfaces and visualization
  • Bioelectronics and bioinformatics
  • Biomedical and microfluidic applications
  • Biotechnologies in the design of nanocircuits
  • Biomedical engineering and biomedical electronics
  • Carrier transport in molecular and biological systems
  • Algorithms and biochips for DNA, healthcare and proteins
  • Micro-nano electromechanical devices for bio- and chemical applications
  • High performance computing, numerical methods and algorithms, including optimization
  • Computational methods and integrated systems for biochemical and medical applications

  • Optoelectronics:
  • Optical Fibers
  • Optical Cables
  • Optical Fiber Devices
  • Fabrication, installations
  • Fiber Bragg gratings
  • Lightwave circuits
  • Optical Fiber amplifiers and lasers
  • Optical Polymer fibers
  • Photonic crystal fibers and related topics
  • Optical Active Devices and Modules
  • Semiconductor lasers, detectors and their arrays
  • Light emitting devices
  • Semiconductor laser amplifiers
  • Waveguide laser amplifiers
  • Optoelectronic/photonic integrated circuits
  • Optical logics, memories and other functional devices
  • Related materials, device fabrication and device physics
  • Packaging and modules and related topics
  • Optical Passive Devices and Modules
  • Optical waveguide integrated devices/circuits; Planar
  • Optical isolators and circulators
  • Optical modulators and switches
  • Optical fiber-waveguide coupling, packaging and modules
  • Planar glass and polymer materials and device fabrication
  • Photonic crystals
  • Optical MEMS, Micro-optics and related topics
  • Optical Transmission Systems and Technologies
  • High speed optical transmissions
  • Wavelength division multiplexing
  • Ultra-long haul transmissions
  • Trans-oceanic systems
  • FTTx systems
  • Optical interconnection
  • Optical signal processing
  • Optical analog systems and related topics
  • Optoelectronic Networks and Applications
  • Optical networking, architectures, design and planning

    Signal Processing
  • Filter design and structures
  • Fast algorithms
  • Adaptive filters
  • Nonlinear Signals and Systems
  • Multirate filtering and filter banks
  • Signal reconstruction
  • Time-frequency analysis
  • Spectral estimation
  • Higher order spectrum analysis
  • Parameter estimation
  • Detection
  • Array signal processing
  • Statistical signal analysis
  • Signal and system modeling
  • Cyclostationary signal analysis
  • Speech production and perception
  • Speech analysis
  • Speech synthesis
  • Speech coding
  • Speech recognition
  • Speech enhancement and noise reduction
  • Active noise control
  • Active noise reduction
  • Echo cancellation
  • Psychoacoustics
  • Broadband audio coding
  • Signal processing for music
  • Binaural systems
  • Room acoustics
  • Digital transforms
  • HDTV
  • Multidimensional systems
  • Machine vision
  • Image coding
  • Image motion / sequence / video
  • Computed imaging
  • Geophysical and seismic processing
  • Image analysis and segmentation
  • Image filtering, restoration and enhancement
  • Image representation and modeling
  • Pattern recognition
  • Multisensor Data Fusion
  • Architectures and VLSI hardware
  • Programmable signal processors
  • Algorithms and applications mappings
  • Design methology and CAD tools
  • Languages and real time software
  • Real time system estimation
  • Optimization problems in signal processing
  • Radar
  • Sonar
  • Biomedical processing
  • Geophysical signal processing
  • Underwater signal processing
  • Remote sensing
  • Robotics
  • Astronomy
  • Satellite signals processing
  • Measure and Instrumentation

  • Communications
  • Microwave Theory and techniques
  • Applications of Microwaves in Biomedicine
  • Computational Methods for Microwaves Engineering
  • CAD design for Microwave Systems
  • Microwaves Circuits
  • Finite Differences, Finite Volumes, Finite Elements for Microwaves
  • Boundary Elements Method (BEM) applied in Microwaves problems
  • Antennas and Radars
  • Finite Differences, Finite Volumes, Finite Elements for Antennas
  • Boundary Elements Method (BEM) applied in Antennas problems
  • Lightwave technology
  • Submillimeter-Wave techniques
  • Microwave High-Power techniques
  • Microwave and millimeter-Wave Integrated Circuits
  • Microwave and millimeter-Wave Integrated Solid State Devices
  • Microwave Acoustics
  • Filter and Passive Components
  • Microwave and Antennas Measurements
  • Microwave Superconductivity
  • RFIC's
  • Wave-guides
  • Microwave propagation
  • Ferrites devices. Cavities. Microwave Circuits
  • Periodic Structures and Filters
  • Tubes
  • Masers
  • Amplifiers
  • HF-VHF-UHF Engineering
  • Antennas
  • Reflectors and Lens Antennas
  • Arrays
  • Scattering
  • Propagation
  • Diffraction
  • Electromagnetic Compatibility Problems
  • Applied Electromagnetics
  • Electromagnetic Field
  • Numerical Methods for Electromagnetics
  • Mathematical Methods and Computational techniques for Microwaves
  • Mathematical Methods and Computational techniques for Antennas and Radars
  • Radio Engineering applications in Astronomy
  • Navigation
  • Aerospace Systems
  • Low noise techniques
  • Optical Fiber Systems
  • Communication Electronics
  • Signal Processing for Wireless Communication.
  • Communications Switching and Routing
  • Physical Layer
  • ISDN
  • Computer Networks
  • Architectural Aspects
  • ATM Networks
  • Protocols
  • Network Architecture
  • Network Reliability
  • Narrow band and Broad band Networks
  • Modern Routing Problems
  • Privacy and Security Problems
  • Queuing Theory and Communications
  • Traffic Problems
  • Wireless and Mobile Computing
  • Communication Systems Integration
  • Cryptology
  • Military Communications
  • Internet
  • Programming Techniques in Communications Networks
  • Simulation Techniques in Telecommunications
  • Software for Communications Development and Simulation
  • Social Implications of Modern Communications
  • Soft Computing and Communications
  • Smart Interfaces
  • Computer/Communications Integration
  • Education.

  • Location and Venue

    About Venice and Hotel


    How to get:

    Conference Publications

    Accepted Papers are going to be published in

    (a) Book, Hard-Copy Proceedings (will be sent to the following indexes: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
    (b) CD-ROM Proceedings (will be sent to the following indexes: ISI, SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
    Review Procees for Book and CD-ROM:
    Papers will undergo thorough peer review by 3 international experts. Reviewers have always proper academic qualifications (recent publications in SCOPUS and ISI). You will receive comments from those 3 reviewers and your paper might be
    * a) accepted as it is (unaltered)
    * b) accepted after minor revision
    * c) accepted after major revision
    * d) rejected
    We cannot guarantee acceptance for cases b) and c), if the reviewers are not satisfied by your response and your (minor or major) modifications to your conference paper.

    (c) After new peer thorough review of their extended versions in well-known and reputable international scientific journals (Indexed in SCOPUS, EI Compendex, AMS, ACS, CiteSeerX, Zentralblatt, British Library, EBSCO, SWETS, EMBASE, CAS, Scholar Google etc)
    Review Process for Extended Version in collaborating journals:
    Extended Versions of high-quality journals will undergo again thorough peer review by 3 international experts. You will receive comments from other reviewers and your extended paper might be
    * a) accepted as it is (unaltered)
    * b) accepted after minor revision
    * c) accepted after major revision
    * d) rejected
    We cannot guarantee acceptance for cases b) and c), if the reviewers are not satisfied by your response and your (minor or major) modifications to your extended paper.

    (d) E-Library